Features
1. Complied to the RoHS directive
2. Semiconductor patch plastic encapsulation package
3. Body size:3225、3535、4032、6355
4. Compact and space-efficient structure
Improved component design in a compact case.
5. Suitable for reflow welding and wave solderingwith surface installation technology
6. High surge current capability. 7. Better stability and reliability under hot and humid conditions
2. Protection for LED circuits.
3. Protection for consumer,industrial equipment.
4. Protection for automotive electronics.
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